TAIPEI (TVBS News) — SEMICON Taiwan 2025, the world's most influential annual semiconductor event, will open on Wednesday (Sept. 10) at the Nangang Exhibition Center (南港展覽中心), setting a record with 1,200 exhibitors, 4,100 booths, and over 100,000 attendees. This year's exhibition will showcase the latest in AI chips, advanced packaging, 3DIC, Chiplet, FOPLP, silicon photonics, and quantum computing technologies.
The event will kick off Sept. 8 with the Silicon Photonics International Forum, featuring industry giants such as Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), ASE Technology Holding Co., Ltd. (日月光), NVIDIA, AMD, Broadcom Corp., Google, MediaTek (聯發科), and Meta. These companies will share insights into advanced processes and next-generation packaging, highlighting trends in silicon photonics technology.
On Sept. 10, a highly anticipated forum will feature a master dialogue with Taiwan Semiconductor Industry Association (TSIA, 台灣半導體協會) Chairman and TSMC Deputy COO Cliff Hou (侯永清), SEMI Global Chairman and ASE CEO Tien Wu (吳田玉), and renowned IC designer Jim Keller. This discussion will focus on the industry's future and emerging trends.
The demand for AI accelerator chips is driving innovations in memory security and transmission speed. SK Hynix, Samsung, and Micron will join Taiwan's memory leaders, including Winbond Electronics Corp. (華邦) and Macronix International Co., Ltd. (旺宏), at a memory summit to explore the AI memory revolution.