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Hsiao: Taiwan provides reliable components for US industry

Reporter TVBS News Staff
Release time:2025/12/02 14:00
Last update time:2025/12/02 17:41
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Taiwan VP highlights TSMC’s historic U.S. investment (Courtesy of the Office of the President) Hsiao: Taiwan provides reliable components for US industry
Taiwan VP highlights TSMC’s historic U.S. investment (Courtesy of the Office of the President)

TAIPEI (TVBS News) — Vice President Hsiao Bi-khim (蕭美琴) described Taiwan Semiconductor Manufacturing Company's (TSMC, 台積電) Arizona investment as the largest greenfield investment by a foreign entity in U.S. history during a U.S. podcast interview that aired Monday (Dec. 1). The investment totals an estimated US$165 billion (around NT$5.12 trillion), including three new wafer fabrication facilities. Hsiao highlighted Taiwan's challenging geopolitical landscape and TSMC's role in U.S. manufacturing reindustrialization during the "War Room" podcast appearance.

Hsiao noted TSMC's Arizona investment supports U.S. automotive and manufacturing sectors by distributing chips to Detroit and other regions for iPhones, AI data centers and automotive applications. The interview covered geopolitics, cross-strait relations, Taiwan's defense autonomy, Taiwan-U.S. relations and U.S. investments, according to a Tuesday press release. TSMC's chips supply critical components for American manufacturing and technology infrastructure.

 

Hsiao stressed Taiwan provides reliable, high-performance semiconductor components that contribute to U.S. manufacturing reindustrialization efforts and establish dependable supply chains for critical technologies. Taiwanese companies aspire to become global enterprises, she stated during the podcast interview, and U.S. collaboration expands Taiwan's global influence while supporting American manufacturing and technology sectors. The partnership strengthens both Taiwan's semiconductor industry leadership position and U.S. technological self-sufficiency in critical chip manufacturing.

TSMC announced plans in March to increase U.S. advanced semiconductor manufacturing investment by US$100 billion (around NT$3.1 trillion), bringing total investment to an estimated US$165 billion (around NT$5.12 trillion). The expansion includes construction of three new wafer fabrication facilities and supporting infrastructure in Arizona. The investment solidifies the Taiwan-U.S. partnership in technology and manufacturing, creating thousands of American jobs in advanced chip production. ◼ (At time of reporting, US$1 equals approximately NT$31)