TAIPEI (TVBS News) — The Industrial Technology Research Institute (工研院, ITRI) showcased 14 cutting-edge technological achievements at NEPCON JAPAN (日本國際電子製造關連展) on Wednesday (Jan. 21). ITRI unveiled the High Power Density 3-in-1 Powertrain, highlighting Taiwan's prowess in developing high-voltage, high-power automotive systems.
ITRI collaborated with ZEPT Inc. (捷能動力科技), an electric vehicle powertrain startup, to launch a powertrain integrating an electric motor, motor control, and a reducer. This system employs self-developed 1700V/400A silicon carbide (SiC) power chips and modules. Chang Shih-chieh (張世杰), director of ITRI's Electronics and Optoelectronics System Research Laboratories, noted SiC's global application due to its high efficiency and power density.
In the "Automotive SiC Technology Solutions" zone, ITRI partnered with Super Power Technology (超能高新) to develop a silicon nitride ceramic substrate, showcasing advanced packaging technology with high reliability and heat resistance. Additionally, ITRI and Nagoya University (名古屋大學) co-developed a 30kW fast-charging DC converter to meet the demand for efficient power conversion systems in the electric vehicle fast-charging market.
ITRI also addressed energy-saving needs for AI data centers in the "DC Grid Technology Solutions" zone by developing a solid-state relay in battery storage systems, enhancing power conversion efficiency and system flexibility. In the "GaN Device Integrated Packaging Solutions" zone, ITRI exhibited a self-developed 650V vertical GaN power chip, boosting component voltage resistance and power density.