TAIPEI (TVBS News) — Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電) showcased its Chiayi Advanced Packaging Fab 7 during a media tour on Thursday (Jan. 22), underscoring the chipmaker's continued investment in Taiwan's advanced packaging capabilities. Cliff Hou (侯永清), senior vice president and co-chief operating officer, led the event and highlighted the facility's role in meeting surging demand driven by the global AI boom.
The Chiayi site, which TSMC describes as transforming from a sugarcane field into a future silicon hub, began equipment installation at its Phase 1 plant in December. TSMC stated the company aims for this fab to become its largest advanced packaging facility worldwide. The facility reinforces TSMC's commitment to providing comprehensive 3D Fabric manufacturing and services for global customers.
Beyond the Chiayi facility, TSMC has expanded its advanced packaging capacity by acquiring a site in the Southern Taiwan Science Park from panel maker Innolux Corporation (群創). This acquisition supports TSMC's efforts to strengthen its semiconductor industry leadership amid rising AI-driven demand. The media event included 20 of TSMC's construction partners. ◼