TAIPEI (TVBS News) — Taiwan Semiconductor Manufacturing Company (TSMC) announced on Wednesday (Feb. 7) that its Japan subsidiary, JASM, will build its second wafer fabrication plant at the end of 2024, with operation expected to commence by the end of 2027.
With strong support from the Japanese government, TSMC stated that its first JASM wafer fabrication plant is planned to begin production in 2024, while the total investment is projected to surpass US＄20 billion.
Due to growing customer demand, JASM's second plant in Japan will start construction by the end of 2024.
Optimizing JASM's overall cost structure and supply chain efficiency, the expansion is expected to increase production.
Once the two plants are operational, JASM's Kumamoto wafer fabrication plant will have a total monthly capacity of over 100,000 12-inch wafers.
The Japan fab will provide 40nm, 28nm, 22nm, 16nm, 12nm, 7nm, and 6nm process technologies relevant to applications in automotive, industrial, consumer, and high-performance computing.
TSMC said that capacity planning could be further adjusted based on client requirements. The Kumamoto wafer plant is anticipated to directly create more than 3,400 high-tech professional jobs.