TAIPEI (TVBS News) — Taiwan Semiconductor Manufacturing Company (TSMC, 台積電) announced Tuesday (Aug. 19) its decision to eliminate 6-inch wafer production entirely by 2027, marking a significant strategic pivot for the world's largest contract chipmaker. The company confirmed plans to shutter Fab 2, its aging 6-inch facility at Hsinchu Science Park (新竹科學園區), Taiwan's premier technology hub, as part of comprehensive operational optimization efforts. This manufacturing consolidation represents TSMC's commitment to streamlining production capabilities while enhancing overall efficiency across its global semiconductor operations.
TSMC currently maintains nine fabrication facilities across Taiwan, comprising four advanced 12-inch mega fabs, four 8-inch facilities, and the single 6-inch operation targeted for closure. The semiconductor leader plans to expand its Taiwan manufacturing footprint to 11 total facilities in coming years. This strategic withdrawal from 6-inch wafer production directly supports TSMC's broader initiative to consolidate and strengthen its 8-inch manufacturing capacity, ultimately enhancing the company's competitive operational capabilities.
Company executives reassured investors that the manufacturing restructuring will not impact previously announced financial projections for the current fiscal period. TSMC maintains its ambitious revenue growth forecast of 30% in U.S. dollar terms for this year, demonstrating confidence in its strategic direction. The chipmaker emphasized that operational consolidation efforts are designed to strengthen rather than compromise its financial performance and market position. ◼