TAIPEI (TVBS News) — Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), the world's largest contract chipmaker, announced Tuesday (Sept. 30) a new energy-saving initiative targeting 8% annual consumption reduction through advanced equipment optimization. The company projects savings of 190 million kilowatt-hours by 2030, cutting carbon emissions by 101,000 metric tons through its EUV dynamic energy saving project. TSMC's sustainability push comes amid growing environmental pressure on semiconductor manufacturing operations globally.
TSMC revealed plans to collaborate with equipment suppliers to decrease extreme ultraviolet lithography (EUV) equipment power consumption by 44%. The initiative integrates processing mechanisms aligned with production demands while utilizing automated systems to ensure energy reduction without compromising manufacturing stability. EUV technology represents the most advanced semiconductor manufacturing process, requiring substantial energy for precision chip production.
TSMC implemented these energy-saving measures in September at Fab 15B, Fab 18A, and Fab 18B manufacturing facilities. The company plans extending the initiative to all domestic and international EUV equipment by year-end, establishing it as the standard for new facilities. TSMC evaluates introducing deep ultraviolet (DUV) equipment and other modules to enhance overall manufacturing energy efficiency beyond current improvements.
TSMC optimized fan structures in cleanroom air transport systems, boosting operational efficiency from 55% to over 60% without altering equipment size or operational requirements. The company introduced this technology in September across Fab 20, Fab 22, and Advanced Packaging Fab 7 facilities, totaling approximately 44,000 units. Cleanroom systems maintain ultra-pure environments essential for semiconductor manufacturing precision and quality control standards.