TAIPEI (TVBS News) — National Taiwan University of Science and Technology (NTUST, 國立台灣科技大學) and Grand Process Technology Corporation (GPTC, 弘塑科技) signed a five-year, NT$50 million industry-academia collaboration agreement on Monday (March 2). This partnership aimed to advance semiconductor equipment and key materials research while fostering the development of high-tech talent.
The university highlighted that advanced packaging technology has evolved into a system engineering endeavor, focusing on equipment integration and material innovation. This evolution demands increased precision in equipment and material design to enhance process stability, material interface reliability, and overall yield control. Both parties plan to establish a dedicated team and technology platform, investing NT$10 million (approximately US$318,000) annually.
The research will target equipment verification, process optimization, and key material development, accelerating development through real-world process verification and data analysis. GPTC will offer exclusive scholarships and pre-employment opportunities to participating master's and doctoral students. These students will engage in advanced equipment operation and process implementation, gaining practical experience through a dual-track model of academic research and industry practice.
The NTUST stated that the partners intend to patent their research outcomes, transforming key technologies into commercially valuable intellectual property. This strategy aims to strengthen their technological barriers and competitive market advantage. (At time of reporting, US$1 equals approximately NT$31.44)