TAIPEI (TVBS News) — AUO (友達光電) will unveil Micro LED optical communications technology and glass core substrates for AI data centers at SEMICON Taiwan 2026 (國際半導體展), opening Wednesday (Sept. 2). The display maker's subsidiary Daxin Materials (達興材料) will showcase optical communications solutions at the three-day trade show. AUO and partners will present a system-level Micro LED co-packaged optics module, while a collaboration with Corning (康寧) will demonstrate glass core substrate technology for advanced semiconductor packaging.
The system-level Micro LED co-packaged optics module targets high-speed transmission over distances of about 10 meters (33 feet) in data centers. AUO handles mass transfer, redistribution layer packaging, optical coupling and system architecture. The module integrates Micro LED transmitters from Ennostar (富采光電), Micro PD receivers from Tyntek (鼎元光電) and Corning's fiber-optic solutions, with plans to use Daxin Materials' photosensitive dielectric insulation material in redistribution layer packaging.
The module is designed for high-speed interconnect applications including co-packaged optics and active optical cables. Unlike solutions using few high-speed optical channels, it employs a wide, lower-speed parallel architecture with multiple Micro LED channels carrying data simultaneously. This approach reduces reliance on power-intensive signal compensation and eases thermal demands.
The Micro LED light source remains stable at temperatures up to 125°C (257°F) and has a service life exceeding 30,000 hours. Its low power consumption helps reduce electricity use and cooling requirements in AI data centers. AUO is developing Micro LED optical communications solutions drawing on 30 years of glass substrate manufacturing experience, with capabilities including optical coupling, heterogeneous integration and precision manufacturing.
AUO's glass core substrates offer a low coefficient of thermal expansion, high dimensional stability and low signal loss. These properties help reduce warpage in large packages while supporting denser circuits and high-speed data transmission. Compared with conventional substrates, glass core substrates are better suited to advanced packaging for AI, high-performance computing, high-bandwidth memory and co-packaged optics.
Wei-Lun Liao (廖唯倫), AUO's chief technology officer and head of its Innovation Research Center, said AI is increasing demand for computing performance. System-level integration across materials, components and modules is becoming increasingly important, Liao said. AUO said Micro LED co-packaged optics and advanced semiconductor packaging are part of its four-pronged AI strategy, with plans to expand applications to data centers and smart cockpits. ◼