CHIAYI (TVBS News) — Vice Premier Cheng Wen-tsan announced on Monday (March 18) that the Taiwan Semiconductor Manufacturing Company (TSMC) will construct two advanced chip packaging CoWoS facilities in the Chiayi Science Park.
Cheng stated that construction of the park's first facility is set to start in May 2024 and is expected to be completed by the end of 2026, with manufacturing to begin in 2028.
He voiced his appreciation for TSMC's global commitment to Taiwan and the positive economic effects these facilities will yield.
"The central government and TSMC are confident in this new project, which will be implemented with the cooperation of both central and local governments," he said.
Chiang Chen-wei, the director of the Chiayi County Economic Development Department, remarked on the benefits this project will bring to the county. The first packaging facility within the park will span around 30 acres and is anticipated to generate roughly 3,000 job opportunities.