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MODA unveils plan to boost semiconductor cybersecurity

Reporter TVBS News Staff
Release time:2024/11/28 10:35
Last update time:2024/11/28 11:26
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MODA unveils plan to boost semiconductor cybersecurity (Shutterstock) MODA unveils plan to boost semiconductor cybersecurity
MODA unveils plan to boost semiconductor cybersecurity (Shutterstock)

TAIPEI (TVBS News) — Taiwan's Ministry of Digital Affairs (MODA, 數位發展部) announced plans on Wednesday (Nov. 27) to bolster chip cybersecurity by aligning with international standards. The initiative aims to enhance the security of semiconductor supply chains, a critical component of the global market.

The Administration for Digital Industries (ADI, 數位產業署) hosted a conference on Tuesday to discuss international trends in chip security testing and certification. Experts from GlobalPlatform, Qualcomm, Arm, and Infineon Technologies shared insights during the event.

 

ADI Acting Director General Lin Jiunn-Shiow (林俊秀) emphasized the importance of Taiwan's semiconductor industry in the international supply chain, stating that since 2022, it has been working with GlobalPlatform on the global harmonization of chip cybersecurity standards.

Lin highlighted ADI's efforts to integrate resources by collaborating with local entities such as MA-tek (閎康科技), Digiforen Technology (鑑智實相), National Chung Hsing University (中興大學), and National Cheng Kung University (成功大學). This collaboration has led to establishing a joint chip security testing laboratory to strengthen Taiwan's chip cybersecurity.

In August, ADI guided the startup IIST (智能資安) to complete the Security Evaluation Standard for IoT Platforms (SESIP) chip security assessment and earn an international certificate from TrustCB.
 

ADI also expressed gratitude to the Taiwan Electrical and Electronic Manufacturers' Association (台灣區電機電子工業同業公會) for their partnership, which helped integrate SESIP standards with companies like Winbond Electronics (華邦電) and MediaTek (聯發科).