TAIPEI (TVBS News) — Taiwan Semiconductor Manufacturing Company (TSMC) announced advancements in its 1.4nm-class technology node, A14, during the IEEE International Electron Devices Meeting (IEDM).
TSMC detailed its production roadmap, with plans to commence volume production of 2nm process chips, known as N2, by 2025. The N2P process is expected to enter mass production by the end of 2026, as reported by Tom's Hardware.
Market analysts, including SemeAnalysis's Dylan Patel, noted that although A14's official designation has been confirmed for the 1.4nm production node, the timeline for its mass production remains undisclosed. Predictions suggest A14 may debut between 2027 and 2028.
TSMC is exploring innovative technologies like vertically-stacked complementary field effect transistors (CFETs) to enhance chip performance and energy efficiency. The initial A14 process may not utilize CFETs, opting for second and third-generation gate-all-around FETs (GAAFETs), which will also feature in the N2 process.
The application of High-NA EUV lithography technology in future processes is a focal point, with its inclusion in the A14 process (expected in 2027-2028) yet to be confirmed. Industry players like Intel are also adopting next-generation EUV technology with a numerical aperture of 0.55, driving advancements in this field.