TAIPEI (TVBS News) — Taiwan Semiconductor Manufacturing Company (TSMC, 台積電) confirmed on Sunday (Aug. 18) that German Chancellor Olaf Scholz will attend the groundbreaking ceremony for TSMC's new plant in Dresden on Aug. 20, underscoring Germany's commitment to local semiconductor manufacturing.
According to a report by Liberty Times, TSMC founder Morris Chang (張忠謀), 93, will not attend the ceremony due to the long flight. Instead, TSMC Chairman and CEO C.C. Wei (魏哲家) will lead the delegation, including Co-COO Y.P. Chyn (秦永沛), Deputy Co-COO Cliff Hou (侯永清), and Deputy Co-COO Kevin Zhang (張曉強).
German contractors, including Dreso, will handle the construction of the office and fab buildings, as well as the cleanroom engineering. Taiwanese suppliers will assist with specialized systems and materials.
The semiconductor supply chain reported that only 150 attendees will participate in the ceremony, focusing on local government officials, contractors, and partner companies.
TSMC announced on Aug. 8, 2023, that it will establish the European Semiconductor Manufacturing Company (ESMC) with Bosch, Infineon Technologies, and NXP. The Dresden plant will primarily serve automotive and industrial applications, with a total investment exceeding 10 billion euros. The facility will cover 51 hectares and utilize 28/22-nanometer CMOS and 16/12-nanometer FinFET technologies, with a monthly capacity of about 40,000 12-inch wafers.